Bongsang Kim received the B.S. degree in mechanical design and production engineering from Seoul National University, Seoul, Korea, and the M.S. and Ph.D. degrees in mechanical engineering with electrical engineering minor from Stanford University, Stanford, CA, in 2004 and 2007, respectively. From 1998 to 2001, he was with Hyundai Mobis as a Mechanical Engineer. He was an Intern with Agilent Labs, Palo Alto, CA, in 2005, working on the development of MEMS nano steppers capable of 1000g’s acceleration.
He is currently working with Professor Clark Nguyen as a Postdoctoral Researcher with the Berkeley Sensor and Actuator Center, University of California, Berkeley. His research interests include RF MEMS, reliability of micro/nanoscale structures, MEMS packaging, material diffusion, and energy loss and stability of micromechanical resonators. Dr. Kim received the Best Student Award at the IEEE Frequency Control Symposium 2007.

Email: bonkim@sandia.gov