Micromachining with XeF2


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Table of Contents

PPT Slide

Introduction

Reaction Probabilities and Rates

Selectivity

A Vapor-phase Gentle Etchant

CMOS Micro-structures released with XeF2

Using XeF2 as an Etchant

A Simple XeF2 Etching System

A XeF2 Etching System with Expansion Chamber

XeF2 Etching System in Idle Mode

Pulse Etching Cycle -- Evacuation

Pulse Etching Cycle -- Gas expansion

Pulse Etching Cycle -- Etching

Pulse Etching Cycle -- Purging

Pulse Etching Cycle -- Evacuation

Pressure Changes in a Pulse Etching Cycle

Photo of the UCLA Etching System

Etching Experiments

Mask Pattern for Etching Experiments

SEMs of Etch Pits from Square Patterns

SEMs of Square Etch Pit Arrays

Bulk Silicon Etch Pit Profile

Bulk Silicon Etching with Variable Time Pulses

Bulk Silicon Etching with Increasing Pulses

Bulk Silicon Etching of Multiple Samples

Total Volume Etched for Multiple Samples

Total Volume Etched Under Different Conditions

Etch Pit Roughness

Surface Roughness for a 200mm Square Opening

Proximity Effect

Etch Result Variations

Polysilicon Film Etching (variable-time pulse)

Polysilicon Film Etching (1 -12 pulses)

XeF2 Pulse Etching Summary

Author: Patrick B. Chu, Ph.D.

Email: pbchu@alum.mit.edu

Home Page: http://synergy.icsl.ucla.edu/~patrick

Other information:
This presentation was prepared for Transducers '97 at Chicago, June 1997. The conference proceeding paper title is "Controlled Pulse-Etching with Xenon Difluoride." This presentation will focus on etching results from pulse-etching with xenon difluoride; however, it should also provide a good introduction to people who are unfamiliar with XeF2.


Brett Warneke - last edited July 25, 2000