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Phillip Sandborn, Ph.D. 2017

Electrical Engineering
Advisor: Prof. Wu
(410) 599-0590

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BIOGRAPHY

MEMS-Electronic-Photonic Heterogeneous Integration (MEPHI) Component Fabrication, Design, and Characterization [BPN721]
Active III-V photonic components and passive Si photonic circuits are integrated with CMOS electronic
circuits in this project. The modular MEMS-Electronic-Photonic Heterogeneous Integration (MEPHI) platform will
make use of the high performance of the individual components and integrate (1) MEMS tunable VCSEL with
high-index-contrast grating (HCG) mirrors, (2) photodetectors, (3) Si photonic waveguides, couplers, and
interferometers, (4) high-efficiency vertical optical coupler between III-V and Si waveguides, and (5) CMOS
circuits for frequency control and temperature compensation. In order to demonstrate the capabilities of the
proposed MEPHI platform, a frequency- modulated continuous-wave laser detection and ranging (FMCW LADAR)
source is being developed. Results have shown that electronic-photonic 3D integration of optoelectronic
components can greatly improve the performance of FMCW LADAR sources. We also demonstrate that
optoelectronic integration improves the bandwidth of optical phase-locked loops (OPLLs).


Current Active Projects:
BPN721
BPN665
 

     Last Updated: Mon 2015-Feb-23 10:43:26

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