Research Interests: I am interested in harsh environment packaging for MEMS sensors. In particular, the packaging of materials such as silicon carbide and aluminum nitride. My research project is part of the Harsh Environment and Telemetry Systems (HEaTS) project.Job Interests: I am currently an R&D Process Engineer at Keysight Technologies (formerly Agilent Technologies and before that Hewlett-Packard).
Matthew Chan received his Bachelors Degree in Mechanical Engineering, Master of Science Degree in Mechanical Engineering, and Doctor of Philosophy in Mechanical Engineering from UC Berkeley in May 2007, November 2010, and December 2013 respectively.
Matthew was advised by Professor Albert Pisano and now works at Keysight Technologies as an R&D Semiconductor Process Engineer.
HEaTS: Bonding of SiC MEMS Sensors for Harsh Environments [BPN413]
Silicon Carbide (SiC) Sensors are appealing for harsh environment MEMS applications, specifically
because of their stability in corrosive environments and their ability to withstand high
temperatures. The long range goal of this project is to develop a robust process to bond SiC sensors
to various metal components in a way that will avoid disrupting high-precision measurements of
strain, acceleration, pressure, and temperature in high-temperature, high-pressure, corrosive
environments. Traditional bonding methods such as soldering, brazing, and welding are not suitable for
joining SiC with metals due to melting point restrictions and induced thermal stresses. The bond
pursued in this work is specifically designed to mitigate thermal strains and permit for bonding
temperatures lower than final operating temperature.