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Matthew Chan, Ph.D. 2013

High Frequency Technology Center
Advisor: Prof. Pisano
(707) 577-2453

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Research Interests: I am interested in harsh environment packaging for MEMS sensors. In particular, the packaging of materials such as silicon carbide and aluminum nitride. My research project is part of the Harsh Environment and Telemetry Systems (HEaTS) project.
Job Interests: Industry research and development; national lab positions; MEMS packaging; and sensor development for oceanographic/maritime applications

BIOGRAPHY
Matthew Chan was born in Calgary, Alberta. He moved to Novato, California in the first grade and navigated his way through the public school system from elementary school to college. He received his Bachelors Degree in Mechanical Engineering in May 2007, as well as his Master of Science Degree in November 2010, both from the University of California, Berkeley.

As an undergraduate student, he conducted research on Silicon Carbide Encapsulation for Harsh Environment Applications under the advisement of Professor Al Pisano and the mentorship of (now Professor) Debbie Senesky. He desired to stay on at UCB to continue working with Silicon Carbide as a graduate student with the Pisano Lab.

Matthew is currently finishing his PhD research on harsh environment packaging for silicon carbide MEMS. His intended graduation date is May 2013.

HEaTS: Bonding of SiC MEMS Sensors for Harsh Environments [BPN413]
Silicon Carbide (SiC) Sensors are appealing for harsh environment MEMS applications, specifically
because of their stability in corrosive environments and their ability to withstand high
temperatures. The long range goal of this project is to develop a robust process to bond SiC sensors
to various metal components in a way that will avoid disrupting high-precision measurements of
strain, acceleration, pressure, and temperature in high-temperature, high-pressure, corrosive
environments. Traditional bonding methods such as soldering, brazing, and welding are not suitable for
joining SiC with metals due to melting point restrictions and induced thermal stresses. The bond
pursued in this work is specifically designed to mitigate thermal strains and permit for bonding
temperatures lower than final operating temperature.


 

     Last Updated: Tue 2014-Feb-04 10:05:33

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