Research Interests: MEMS, FEAJob Interests: Industry
Package-Derived Influences on Micromechanical Resonator Stability [BPN734]
Vacuum encapsulation of RF disk and beam resonators is necessary in order to maintain high Q and
frequency stability. However, the difference in the coefficient of thermal expansion of the package
material and the substrate lead to package induced stress. This project aims to explore the effects of
this stress on the frequency response of the resonators using finite element analysis (FEA) software.
Simulations performed on resonators packaged using conventional hermetic encapsulation techniques such
as anodic and fusion bonding will be compared to that of an in situ packaging method where the
resonators are housed in a polysilicon shell.