BERKELEY SENSOR & ACTUATOR CENTER
UC BERKELEY UC DAVIS
User: Guest |  Site Map |  My BSAC Profile
HOME  PROJECTS  THRUSTS  PUBLICATIONS  ABOUT BSAC  DIRECTORY  ALUMNI  FOR BSAC RESEARCHERS  EVENTS CALENDAR  SECURE LOGIN
Alumni
     
 
Divya Kashyap, M.S. 2014

Electrical Engineering
Advisor: Prof. Nguyen
(504) 352-3373
Research Interests: MEMS, FEA
Job Interests: Industry

BIOGRAPHY

Package-Derived Influences on Micromechanical Resonator Stability [BPN734]
Vacuum encapsulation of RF disk and beam resonators is necessary in order to maintain high Q and
frequency stability. However, the difference in the coefficient of thermal expansion of the package
material and the substrate lead to package induced stress. This project aims to explore the effects of
this stress on the frequency response of the resonators using finite element analysis (FEA) software.
Simulations performed on resonators packaged using conventional hermetic encapsulation techniques such
as anodic and fusion bonding will be compared to that of an in situ packaging method where the
resonators are housed in a polysilicon shell.


Current Active Projects:
BPN734
 

     Last Updated: Tue 2014-Aug-12 10:43:46

back to Researchers



 

  • Copyright Notification: All papers downloaded from this site are © University of California or the publisher, all rights reserved. Contact the BSAC Webmaster for permission related to copyrighted materials.
  • Links on these pages to commercial sites do not represent endorsements by UC or its affiliates.
  • Privacy Policy
  • Contact Us

   webmaster@bsac.eecs.berkeley.edu
  User logged in as: Guest
  User Idle since: December 21, 2014, 11:06 pm