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Jim Cheng, Ph.D. 2009

Electrical Engineering
Advisor: Prof. Pisano
(510) 643-9752
chengjcm@eecs.berkeley.edu

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Research Interests: NEMS, MEMS, nanomanufacturing, biodiagnostics
Job Interests: industry R&D, academic

BIOGRAPHY
Jim received his B.Eng. in Electrical Engineering from McMaster University, Canada in 2004. He received his M.S. and Ph.D. degrees from University of California, Berkeley in Electrical Engineering in 2006 and 2009, respectively. His research interests are in NEMS/MEMS and their applications to energy and medicine. Thus far, his research has focused on rapid, energy efficient nanomanufacturing processes, next-generation thermal management devices, biologically-inspired MEMS sensors and next-generation energy storage utilizing nanocomposites. Outside of research he enjoys exploring the Bay Area, music, backpacking and swimming.

QES: Micro LHP Chip Cooling System [BPN394]
Thermal management of high power density electronics is an essential, enabling technology for next generation electronic systems. Phase change is the preferred choice for heat transport solutions because of the ability to absorb large heat fluxes through latent heat. Current technology uses macro- scale capillary driven systems such as Loop Heat Pipes (LHP) and thermosyphons, which are passive devices that have proved to be efficient and reliable. However, these devices do not allow for chip- level integration and do not scale well for future (and even current cutting-edge high-performance) electronic requirements. The goal of the microColumnated Loop Heat Pipe (cLHP) project is to develop a "thermal ground plane" (analogous to an electronic ground plane) which is a uniform, isothermal substrate for transporting heat away from high power density electronic devices.


 

     Last Updated: Tue 2013-Aug-06 12:22:27

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