Fall 2012 IAB & Research Review
September 19 to 21

Plenary 9: Late News I Dr. Jim Cheng


micro Loop Heat Pipes (m-LHP) - Passive solution to the thermal dilemma

The m-LHP is an integrated heat-spreading substrate that efficiently removes waste heat from high-power electronic circuits using both evaporative heat transfer (i.e. phase change) and capillary-driven mass transport. This ultra-thin (<1.5 mm), planar device is capable of integration with a wide variety of electronic substrate materials such as Si, GaAs, and InP. This talk will cover recent results of this DARPA sponsored project from several experimental demonstrations: evaporator testing (showing 6800 W/m.K thermal conductivity, hermetic sealing and the working full 2D prototype in silicon.