Fall 2010 IAB
September 15 to 17
MEMS Microscale Heat Transfer Using Phase Change
A high conductivity substrate which can be interfaced directly with high heat flux chips is described. Phase change technology is the preferred choice given its ability to absorb large heat fluxes through latent heat. Efficient, reliable passive Capillary Loop Heat Pipes (LHP) and thermosyphons with a novel columnated wick design to prevent wick dryout uses novel MEMS micro-fabrication techniques and materials. The proposed micro LHP (mLHP) will be a modular and scaleable device fabricated on the wafer level to transport high heat fluxes in high-g environments.