Fall 2010 IAB
September 15 to 17

Chen Yang


Drop-Shock Dynamic Simulation of Package/MEMS System

Accidental drop-caused shock wave is a major cause of MEMS failure.
Current state-of-the-art research works have done little on the drop analysis of package/MEMS systems. In this work, dynamic responses of package under high-g drop-shock and the impact to MEMS device reliability originated from the micro-packaging interfacial contacts are investigated. Dynamic simulation method on drop-shock of package/MEMS is developed for different types of packages and MEMS structures. Deformation generated during the drop tests for MEMS components and the potential failure issues are predicted. High-g drop test system is set up for experimental verification. This work can enhance the reliability of the MEMS design.