Fall 2010 IAB
September 15 to 17
Semi-Permeable Encapsulation Membranes Using Carbon Nanotubes
The primary goal of this project is to develop a unique composite layer with carbon nanotubes to achieve both the release and encapsulation of devices fabricated on silicon wafers. A composite membrane of carbon nanotubes and polysilicon may achieve desired permeability for sacrifical etching of underlying oxides, followed by low pressure chemical vapor deposition to seal the released cavity in vacuum. This project provides an efficient, reliable alternative to wafer bonding packaging techniques which do not offer the streamlining of fabrication steps or possibility of post-encapsulation processing.