Ultrasonic Microfluidic Devices

{ FPW wafer, packaging, oscillator board }

Photograph showing a wafer of FPW devices, a single FPW die mounted in a zero insertion force package, and an oscillator board.


Goals:


Funding Source:


Personnel:


Typical Devices Under Study:


FPW Fabrication Process:


Links related to our research:


LAST UPDATED October 7, 1997
pamela@eecs.berkeley.edu

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