Package, Process & Microassembly

Here you will find Projects dealing with: Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice. Silicon Carbide process for adverse environment MEMS and high frequency RF resonators. Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation. Fluidic microassembly for post-process combining of dissimilarly processed microdevices. Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments. Stiction mitigation for MEMS.

 Indicates a MiNaSIP Project

Recently Ended Projects:

2D Individually-Addressable Nanowire Arrays

Adhesion in MEMS

Centura Deep Silicon and Oxide Etch Characterization

CMOS Integrated Nanowires/Nanotubes (CMOS-Inn)

CMOS-Compatible Synthesis of Carbon Nanotubes for Sensor Applications

Dedicated SiC MEMS LPCVD Reactor for Access through the DARPA MEMS Exchange Program

Direct-Write Piezoelectric PVDF Nanogenerator via Near-Field Electrospinning

Disposable Microsyringe for Single Dose Vaccine Delivery

DRIE Process Optimization for Very Smooth Sidewall Etch

Effects of Boron Concentration on Si1-xGex Properties for Integrated MEMS Technology

Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces

Endeavor AT Aluminum Nitride Deposition Process Characterization

Fabrication of a High Aspect Ratio Piezoelectric Microactuator

Fluidic assembly of RF receiver with glass-substrate inductors & antenna

Fluidic Microassembly for Microfluidic Applications

FTIR In Situ Depth Measurement System for DRIE

HEaTS: High Temperature Bonding Technology for SiC Devices - Au-Sn SLID

Hermetic Bonding for Optical Feed-through

Integration of NEMS and MEMS by Localized Growth of Nanowires

Large Area Semi-Permeable Encapsulation Membranes Using Carbon Nanotube Composites

MEMS Biopolymer: Micro Plastic Injection Molded Fluidic Chip with Thermally Actuated Hydrogel Valves

MEMS Microfabrication and Research Services at the Adriatic Research Institute

MEMS Strain Gauge on Steel: Elastic Encapsulation

MEMS Supercapacitor

MEMS-Based Magnetic Probe Microscopy

Micro Magnetic Shielded Packaging

Micro Plastic Injection Molding: Microneedle Molding

Micro/Nano Fluidic Interconnector

Microconnector

MiNaSIP 2.C.1: MEMS Packaging Beyond Glass Frit

MiNaSIP 2.C.2: Zero-Stress MEMS Packaging

Modeling of Temperature Effects on Piezoresistor Sensitivity

Nano-Getters for MEMS Applications

Nanowire-Coupled Resonators

Nickel Nanocomposite Film for MEMS Applications

Non-magnetic Micro Heater

Novel SiGe Processes for Electrostatically Actuated MEMS Resonators

On-Chip DNA Transformation by Local Heat Shock and Cell Cryopreservation

Plastically Self-Alligned Micromirrors

Rapid Bonding of MEMS Strain Gauge to Steel

Rapid Synthesis of Nanostructures via Induction Heating

Reversible Bonding Process Development

SAM for MEMS Packaging/Fuel Cell Applications

Selective Induction Heating for MEMS Packaging

SiC TAPS: Characterization of Silicon Carbide Ion Beam Assisted Deposition (IBAD) Films

SiC TAPS: Ion Beam Assisted Deposition (IBAD) Encapsulation

SiC TAPS: Ion Beam Deposited SiC for MEMS Encapsulation

SiGe Processing for the Fabrication of a Floating Electromechanical System (FLEMS) Gyroscope

Silicon carbide process development and characterization for harsh-environment sensors

Silicon on Insulator Microassembly

Stiction in MEMS

Tools for Microassembly

VUV Lamp Assembly for Wafer Scale Surface Modification

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