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Package, Process & Microassembly

Package, Process & Microassembly

Here you will find Projects dealing with:
  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice.
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators.
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation.
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices.
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments.
  • Stiction mitigation for MEMS.

Current Active Projects:
BPN729: Development of Microfluidic Devices with Embedded Microelectrodes using Electrodeposition and Hot Embossing
BPN354: The Nanoshift Concept: Innovation through Design, Development, Prototyping, and Fabrication Services

Recently Ended Projects:
2D Individually-Addressable Nanowire Arrays
3D Printed Smart Application with Embedded Electronics Sensors and Systems
Adhesion in MEMS
Air-Coupled Piezoelectric Micromachined Ultrasonic Transducers
AM Fitzgerald: MEMS Design, Prototyping, Modeling, Failure Prediction, and Foundry Transfer
Automated System for Assembling a High-Density Microwire Neural Recording Array
Bridging Research-to-Commercialization Gaps In an Industry/University Ecosystem
Centura Deep Silicon and Oxide Etch Characterization
CMOS Integrated Nanowires/Nanotubes (CMOS-Inn)
CMOS-Compatible Synthesis of Carbon Nanotubes for Sensor Applications
Dedicated SiC MEMS LPCVD Reactor for Access through the DARPA MEMS Exchange Program
Direct-Write Piezoelectric PVDF Nanogenerator via Near-Field Electrospinning
Disposable Microsyringe for Single Dose Vaccine Delivery
DRIE Process Optimization for Very Smooth Sidewall Etch
Effects of Boron Concentration on Si1-xGex Properties for Integrated MEMS Technology
Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces
Electronic Skin: Fully Printed Electronic Sensor Networks
Endeavor AT Aluminum Nitride Deposition Process Characterization
Fabrication of a High Aspect Ratio Piezoelectric Microactuator
Fluidic assembly of RF receiver with glass-substrate inductors & antenna
Fluidic Microassembly for Microfluidic Applications
FTIR In Situ Depth Measurement System for DRIE
HEaTS: Bonding of SiC MEMS Sensors for Harsh Environments
HEaTS: High Temperature Bonding Technology for SiC Devices - Au-Sn SLID
Hermetic Bonding for Optical Feed-through
Impedance Sensing Device to Monitor Pressure Ulcers
Integration of NEMS and MEMS by Localized Growth of Nanowires
Large Area Semi-Permeable Encapsulation Membranes Using Carbon Nanotube Composites
Liquid Heterojunction Sensors
Magnetic Particle Flow Cytometer
MEMS Biopolymer: Micro Plastic Injection Molded Fluidic Chip with Thermally Actuated Hydrogel Valves
MEMS Microfabrication and Research Services at the Adriatic Research Institute
MEMS Strain Gauge on Steel: Elastic Encapsulation
MEMS Supercapacitor
MEMS-Based Magnetic Probe Microscopy
Micro Magnetic Shielded Packaging
Micro Plastic Injection Molding: Microneedle Molding
Micro/Nano Fluidic Interconnector
MiNaSIP 2.C.1: MEMS Packaging Beyond Glass Frit
MiNaSIP 2.C.2: Zero-Stress MEMS Packaging
Modeling of Temperature Effects on Piezoresistor Sensitivity
Nano-Getters for MEMS Applications
Nanowire-Coupled Resonators
Nickel Nanocomposite Film for MEMS Applications
Non-magnetic Micro Heater
Novel SiGe Processes for Electrostatically Actuated MEMS Resonators
On-Chip DNA Transformation by Local Heat Shock and Cell Cryopreservation
Package-Derived Influences on Micromechanical Resonator Stability
Plastically Self-Alligned Micromirrors
QES: Micro LHP Cooler - An In-Situ Hermetic Seal for High Heat Flux Microfluidic Devices
Rapid Bonding of MEMS Strain Gauge to Steel
Rapid Synthesis of Nanostructures via Induction Heating
Reversible Bonding Process Development
SAM for MEMS Packaging/Fuel Cell Applications
Selective Induction Heating for MEMS Packaging
SiC TAPS: Characterization of Silicon Carbide Ion Beam Assisted Deposition (IBAD) Films
SiC TAPS: Ion Beam Assisted Deposition (IBAD) Encapsulation
SiC TAPS: Ion Beam Deposited SiC for MEMS Encapsulation
SiGe Processing for the Fabrication of a Floating Electromechanical System (FLEMS) Gyroscope
Silicon carbide process development and characterization for harsh-environment sensors
Silicon on Insulator Microassembly
Stiction in MEMS
Tools for Microassembly
VUV Lamp Assembly for Wafer Scale Surface Modification



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