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APP54: MEMS Strain Gauge on Steel: Testing Localized Silicon-Steel Bonds

Project ID APP54
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Start Date NO START DATE RECORDED
Last Updated Mon 2003-Feb-10 16:43:44
Abstract A rapid bonding process for installing vacuum sealed MEMS strain sensor modules to mechanical components is being developed. This innovative process will be developed to replace conventional adhesive-based approaches. In particular, the silicon to steel bond must achieve these stringent requirements: long life, resistance to chemicals, short bonding process time, and a wide range of storage temperatures. To ensure that the strain within a steel substrate will be accurately measured by the MEMS strain gauge, properties of the bond layer between silicon and steel are observed and determined.
Status Continuing
Funding Source Federal
IAB Research Area Physical Sensors & Devices
Researcher(s) Theodore Prescop
Advisor(s) Albert P. Pisano, Liwei Lin
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