| Project ID |
APP54 |
| Website |
|
| Start Date |
NO START DATE RECORDED |
| Last Updated |
Mon 2003-Feb-10 16:43:44 |
| Abstract |
A rapid bonding process for installing vacuum sealed MEMS strain sensor modules to mechanical components is being developed. This innovative process will be developed to replace conventional adhesive-based approaches. In particular, the silicon to steel bond must achieve these stringent requirements: long life, resistance to chemicals, short bonding process time, and a wide range of storage temperatures. To ensure that the strain within a steel substrate will be accurately measured by the MEMS strain gauge, properties of the bond layer between silicon and steel are observed and determined. |
| Status |
Continuing |
| Funding Source |
Federal |
| IAB Research Area |
Physical Sensors & Devices |
| Researcher(s) |
Theodore Prescop |
| Advisor(s) |
Albert P. Pisano, Liwei Lin |
|
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