| Project ID |
APP55 |
| Website |
|
| Start Date |
NO START DATE RECORDED |
| Last Updated |
Tue 2005-Aug-30 15:21:27 |
| Abstract |
This project aims to design strain isolation trenches into the sensor package such that strain may be selectively isolated in specific sections, and along specific directions thereby reducing the cross-axis sensitivity of the strain sensor. The particular sensor package is an encapsulated, resonating MEMS strain gauge specially designed to be direct-mounted on steel with a strain resolution of 0.1u-strain. To this end, a strain isolation structure was designed that rejects cross-axis strain while still maintaining axial strain fidelity. A test structure is being fabricated to apply on chip strain to the structure and verify cross-axis rejection. |
| Status |
Continuing |
| Funding Source |
Federal |
| IAB Research Area |
Physical Sensors & Devices |
| Researcher(s) |
I-yang Chen |
| Advisor(s) |
Albert P. Pisano |
|
|
