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APP56/OO: Thermally-induced residual stresses in MEMS sensors

Project ID APP56/OO
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Start Date NO START DATE RECORDED
Last Updated Thu 2007-Feb-22 14:16:38
Abstract In the course of eutectically bonding MEMS sensors to a substrate, residual thermal stresses can be induced in the sensor. These stresses have the potential to bias sensor signals, damage encapsulation and alter the operational range of the device. Using thermo- mechanical analyses, the goal of this work is to characterize the residual stresses and seek ways to ameliorate their effects on sensor packaging and operation.
Status Continuing
Funding Source Federal
IAB Research Area Physical Sensors & Devices
Researcher(s) Bayram Orazov
Advisor(s) Oliver M. O'Reilly, Albert P. Pisano
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