| Project ID |
APP56/OO |
| Website |
|
| Start Date |
NO START DATE RECORDED |
| Last Updated |
Thu 2007-Feb-22 14:16:38 |
| Abstract |
In the course of eutectically bonding MEMS sensors to a substrate, residual thermal stresses can be induced in the sensor. These stresses have the potential to bias sensor signals, damage encapsulation and alter the operational range of the device. Using thermo- mechanical analyses, the goal of this work is to characterize the residual stresses and seek ways to ameliorate their effects on sensor packaging and operation. |
| Status |
Continuing |
| Funding Source |
Federal |
| IAB Research Area |
Physical Sensors & Devices |
| Researcher(s) |
Bayram Orazov |
| Advisor(s) |
Oliver M. O'Reilly, Albert P. Pisano |
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