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APP77: MEMS Strain Gauge on Steel: Elastic Encapsulation

Project ID APP77
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Start Date Mon 2003-Aug-11 16:32:46
Last Updated Wed 2006-Aug-23 11:54:36
Abstract The MEMS strain gauge on steel project aims to design a MEMS strain gauge that can be bonded directly to steel and accurately measure strain in small strain fields (gauge length of 1 mm or less). Encapsulation of the MEMS strain gauge, in contrast to microelectronics or inertial force sensor packaging, requires that the package be a mechanical transducer of the measurand to the sense elements. To meet the objective of hermetic, minimally-aliasing encapsulation of the strain gauge, we propose an elastic, wafer-level solution.
Status Continuing
Funding Source Federal
IAB Research Area Package, Process & Microassembly
Researcher(s) Robert G. Azevedo
Advisor(s) Albert P. Pisano
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