| Project ID |
APP77 |
| Website |
|
| Start Date |
Mon 2003-Aug-11 16:32:46 |
| Last Updated |
Wed 2006-Aug-23 11:54:36 |
| Abstract |
The MEMS strain gauge on steel project aims to design a MEMS strain gauge that can be bonded directly to steel and accurately measure strain in small strain fields (gauge length of 1 mm or less). Encapsulation of the MEMS strain gauge, in contrast to microelectronics or inertial force sensor packaging, requires that the package be a mechanical transducer of the measurand to the sense elements. To meet the objective of hermetic, minimally-aliasing encapsulation of the strain gauge, we propose an elastic, wafer-level solution. |
| Status |
Continuing |
| Funding Source |
Federal |
| IAB Research Area |
Package, Process & Microassembly |
| Researcher(s) |
Robert G. Azevedo |
| Advisor(s) |
Albert P. Pisano |
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