| Project ID |
BPN352 |
| Website |
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| Start Date |
Mon 2006-Jul-31 17:36:57 |
| Last Updated |
Tue 2008-Aug-12 09:24:14 |
| Abstract |
In this project, near-field electrospinning (NFES) is applied for site-specific, chip-to-chip micro/nano fluidic interconnectors. This fabrication/packaging technology enables off-chip fluidic transportations through fluidic channels of 50nm~5μm in diameter. Near-field electrospinning has the position controllability better than 10μm in contrast to the random deposition of conventional electrospinning. |
| Status |
Continuing |
| Funding Source |
DARPA |
| IAB Research Area |
Package, Process & Microassembly |
| Researcher(s) |
SangHoon Lee |
| Advisor(s) |
Liwei Lin |
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