BERKELEY SENSOR & ACTUATOR CENTER
UC BERKELEY UC DAVIS
User: Guest |  Site Map |  My BSAC Profile
HOME  PROJECTS  THRUSTS  PUBLICATIONS  ABOUT BSAC  DIRECTORY  ALUMNI  FOR BSAC RESEARCHERS  EVENTS CALENDAR  SECURE LOGIN
Lin
     
 Lee
 Lin
 Wu
 

BPN361: MiNaSIP 2.C.1: MEMS Packaging Beyond Glass Frit

Project ID BPN361
Website
Start Date Wed 2007-Jan-24 20:38:47
Last Updated Tue 2009-Aug-11 10:26:58
Abstract Glass frit bonding is a largely popular method of encapsulating MEMS devices in the industry today. It's popularity is due to relatively low processing temperature, tunability of thermal coefficient of expansion, and hermetic sealing. However, glass frit bonding requires a large amount of space, sometimes as much as several times the size of the MEMS device itself. This attribute is largely responsible for limiting further scalability and miniaturization of individual dies. This research project aims (1) to take a deeper look into the shortcomings of the existing glass frit bonding technique, (2) to identify novel packaging materials and/or techniques for bonding, and (3) to gain a deeper understanding of the stresses induced during and after the packaging process. The long-term objective of this project is to understand and engineer the physics of micro/macro bonding interface to improve the system performances in terms of stability, reliability, offset.
Status Continuing
Funding Source MiNaSIP
IAB Research Area Package, Process & Microassembly
Researcher(s) Jiyoung Chang
Advisor(s) Liwei Lin
Detailed Information
Secure Access

Private Abstract
Research Report
Poster
Summary Slide PDF | VIDEO
Active Feedback (or Request for Response)

 

  • Copyright Notification: All papers downloaded from this site are © University of California or the publisher, all rights reserved. Contact the BSAC Webmaster for permission related to copyrighted materials.
  • Links on these pages to commercial sites do not represent endorsements by UC or its affiliates.
  • Privacy Policy
  • Contact Us

   webmaster@bsac.eecs.berkeley.edu
  User logged in as: Guest
  User Idle since: November 24, 2014, 9:47 am