| Project ID |
BPN413 |
| Website |
|
| Start Date |
Tue 2007-Aug-14 21:07:40 |
| Last Updated |
Tue 2013-Jan-29 18:26:25 |
| Abstract |
Silicon Carbide (SiC) Sensors are appealing for harsh environment MEMS applications, specifically
because of their stability in corrosive environments and their ability to withstand high
temperatures. The long range goal of this project is to develop a robust process to bond SiC sensors
to various metal components in a way that will avoid disrupting high-precision measurements of
strain, acceleration, pressure, and temperature in high-temperature, high-pressure, corrosive
environments. Traditional bonding methods such as soldering, brazing, and welding are not suitable for
joining SiC with metals due to melting point restrictions and induced thermal stresses. The bond
pursued in this work is specifically designed to mitigate thermal strains and permit for bonding
temperatures lower than final operating temperature. |
| Status |
Continuing |
| Funding Source |
Federal |
| IAB Research Area |
Package, Process & Microassembly |
| Researcher(s) |
Matthew W. Chan |
| Advisor(s) |
Albert P. Pisano |
|
|
