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BPN464: Wafer-scale Heterogeneous Assembly of Highly Ordered Semiconductor Nanowire Arrays by Contact Printing

Project ID BPN464
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Start Date Sat 2008-Jul-26 22:25:14
Last Updated Sat 2010-Jan-23 15:05:07
Abstract We have achieved wafer-scale assembly of highly ordered arrays of NWs through a simple contact printing method which yielded high uniformity and reproducibility. In the assembled NW arrays, NW density was readily modulated through the surface chemical treatment of the receiver substrate. We have demonstrated that our printing approach is generic and a wide range of semiconductor NWs have been successfully assembled and integrated at large-scale. More importantly, we have developed nanowire roll printing to demonstrate the potential of a roll-to-roll nanowire printing process for highthrougput nanowire electronics. In our work, arrays of printed NWs were configured as a variety of functional electronic and optoelectronic devices, including high performance field-effect transistors, Schottky diodes and photodiodes on both Si and plastic substrates. As a proof of concept, we have successfully demonstrated heterogeneous integration of functional NW materials together for image sensing circuitry.
Status Completed
Funding Source Industry
IAB Research Area NanoTechnology: Materials, Processes & Devices
Researcher(s) Toshitake Takahashi, Kuniharu Takei, Zhiyong Fan, Johnny C. Ho, Alexandra L. Ford
Advisor(s) Ali Javey
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