BPN491: SiC TAPS: Ion Beam Deposited SiC for MEMS Encapsulation

Project ID BPN491 Website Start Date Wed 2009-Jan-28 16:48:49 Last Updated Mon 2010-Feb-08 11:28:38 Abstract This project seeks to create a harsh environment encapsulated strain sensor useful in high temperature and high shock environments. Status Continuing Funding Source DARPA IAB Research Area Package, Process & Microassembly Researcher(s) David R. Myers Advisor(s) Albert P. Pisano

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