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BPN662: QES: Micro LHP Cooler - An In-Situ Hermetic Seal for High Heat Flux Microfluidic Devices

Project ID BPN662
Website
Start Date Mon 2012-Jan-30 22:01:07
Last Updated Thu 2013-Jan-17 19:07:05
Abstract The ultimate project goal for the micro Loop Heat Pipe Chip Cooling System is to design and fabricate a substrate with high thermal conductivity that can be interfaced directly with high heat flux electronic chips. This new technology will be capable of satisfying the constantly increasing cooling requirements of today's electronic devices. A prototype has already been developed that utilizes phase change technology to absorb large heat fluxes through latent heat. In order to perform functional testing, however, a reliable hermetic sealing method must be developed. The major challenge in developing this sealing method is that it must seal the device in-situ to prevent non-condensable gasses from entering the system. This research is focused on identifying the most viable method for in-situ microfluidic device sealing.
Status Continuing
Funding Source DARPA
IAB Research Area Micropower
Researcher(s) Gordon D. Hoople
Advisor(s) Albert P. Pisano
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