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NanoTechnology: Materials, Processes & Devices
     
 

BPN721: MEMS-Electronic-Photonic Heterogeneous Integration (MEPHI) Component Fabrication, Design, and Characterization

Project ID BPN721
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Start Date Wed 2013-Aug-14 20:43:15
Last Updated Mon 2014-Aug-18 12:14:19
Abstract Active III-V photonic components and passive Si photonic circuits are integrated with CMOS electronic circuits in this project. The modular MEMS-Electronic-Photonic Heterogeneous Integration (MEPHI) platform will make use of the high performance of the individual components and integrate (1) MEMS tunable VCSEL with high-index-contrast grating (HCG) mirrors, (2) photodetectors, (3) Si photonic waveguides, couplers, and interferometers, (4) high-efficiency vertical optical coupler between III-V and Si waveguides, and (5) CMOS circuits for frequency control and temperature compensation. In order to demonstrate the capabilities of the proposed MEPHI platform, a frequency- modulated continuous-wave laser detection and ranging (FMCW LADAR) source is being developed. Results have shown that electronic-photonic 3D integration of optoelectronic components can greatly improve the performance of FMCW LADAR sources. We also demonstrate that optoelectronic integration improves the bandwidth of optical phase-locked loops (OPLLs).
Status Continuing
Funding Source DARPA
IAB Research Area NanoPlasmonics, Microphotonics & Imaging
Researcher(s) Phillip A.M. Sandborn, Behnam Behroozpour, Sangyoon Han
Advisor(s) Ming C. Wu
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