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BSAC2: Reversible Bonding Process Development

Project ID BSAC2
Website
Start Date Wed 2003-Aug-13 14:59:02
Last Updated Thu 2003-Aug-14 21:26:10
Abstract Reversible bonding process is often used in MEMS fabrication where one side of the wafer need to be protected against the subsequent process, or to protect part of the equipment from exposing to the environment in DRIE through wafer etch, and the application list goes on. It plays a low profile supporting role in many of the fabrication processes. Its importance is often over looked, however. A badly designed bonding process has devastating consequences. Better reversible bonding processes are needed. Several reversible bonding process have been developed to suite various processing needs. The releasing mechanisms for each of the bonding process have been established. The cost for each process has estimated.
Status New
Funding Source Federal
IAB Research Area Package, Process & Microassembly
Researcher(s) Ning Chen, Mathew Wasilik
Advisor(s) BSAC Engineering Staff
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