| Project ID |
KSJP33a |
| Website |
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| Start Date |
Tue 2005-Aug-30 10:58:17 |
| Last Updated |
Tue 2005-Aug-30 17:45:40 |
| Abstract |
Complex three dimensional micromechanical systems can be built using multi-layer MEMS processes. There is however a tradeoff available between process complexity and post-fabrication complexity (assembly operations). In this project, we fabricate sockets, connectors and the tools to pick up and rotate them using a single mask Silicon-on-Insulator (SOI) process. We then use pick and place assembly to create complex mechanical micro-systems which are difficult to realize with conventional fabrication techniques. |
| Status |
New |
| Funding Source |
Other |
| IAB Research Area |
Package, Process & Microassembly |
| Researcher(s) |
Subramaniam Venkatraman |
| Advisor(s) |
Kristofer S.J. Pister |
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