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LWL14: Selective Induction Heating for MEMS Packaging

Project ID LWL14
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Start Date NO START DATE RECORDED
Last Updated Wed 2004-Aug-18 13:40:50
Abstract Develop a wafer bonding and hermetic sealing technology based on induction heating for MEMS and IC post packaging.
Status Continuing
Funding Source
IAB Research Area Package, Process & Microassembly
Researcher(s) Andrew Cao
Advisor(s) Liwei Lin
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