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RTH31: Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces
| Project ID |
RTH31 |
| Website |
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| Start Date |
NO START DATE RECORDED |
| Last Updated |
Fri 2003-Aug-08 07:39:19 |
| Abstract |
The overall objective of this project is to extend the understanding of the fluidic microassembly technique using capillary forces. Specifically, the focus has been to obtain single to multiple electrical interconnects between microcomponents and the substrate. |
| Status |
Continuing |
| Funding Source |
Industry |
| IAB Research Area |
Package, Process & Microassembly |
| Researcher(s) |
Karen L. Scott |
| Advisor(s) |
Roger T. Howe, Clay J. Radke |
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