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RTH31: Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces

Project ID RTH31
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Start Date NO START DATE RECORDED
Last Updated Fri 2003-Aug-08 07:39:19
Abstract The overall objective of this project is to extend the understanding of the fluidic microassembly technique using capillary forces. Specifically, the focus has been to obtain single to multiple electrical interconnects between microcomponents and the substrate.
Status Continuing
Funding Source Industry
IAB Research Area Package, Process & Microassembly
Researcher(s) Karen L. Scott
Advisor(s) Roger T. Howe, Clay J. Radke
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