| Instructor
Office Hours |
Kristofer S.J. Pister
pister@eecs <-- easiest method of contact 512 Cory Hall M 2-3, Th 3:30-4:30, and by email appointment |
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| Required Texts | ||||||||
| Suggested references | Elwenspoek & Jansen, Silicon Micromachining
Jaeger, Introduction to Microelectonic Fabrication Kovacs, Micromachined Transducers Sourcebook Madou, Fundamentals of Microfabrication Ristic, Sensor Technology and Devices Senturia, Microsystem Design Sze, Semiconductor Sensors |
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| Grading |
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| Homework | Will emphasize design, layout, and simulation of devices and systems
Collaboration is encouraged! Cheating is not! |
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| Project | Writeup is due the last week of class. Four pages max, two column
format, no exceptions!
Collaboration is encouraged. |
| Week | Date | Topic | HW | Notes | Solutions/
Grades |
| 1 | 8/28
8/30 |
Introduction: what is MEMS, and what subset will ee245 cover?
|
HW1 | Intro.ppt,pdf | |
| 2 | 9/4
9/6 |
Lateral resonators: springs, combs, and resonance
capacitive accelerometers: capacitive sensing and force feedback |
HW2 | Sensors.ppt,pdf | HW2soln.pdf
HW2.SIDs |
| 3 | 9/11
9/13 |
Deposition: Spin casting, Thermal oxidation, LPCVD, Sputtering, ion
imp.
Etching: wet, plasma, XeF2, Williams etch table |
HW3 | Fab1.ppt,,
pdf
WilliamsEtch.pdf |
HW3soln.pdf
HW3.SIDs |
| 4 | 9/18
9/20 |
Bulk micromachining: crystal planes, anisotropic etchants, boron doping
Bulk examples: "standard", 110 etching, 111 (Dan Cho) etching |
foldup crystal.pdf | ||
| 5 | 9/25
9/27 |
Surface micromachining: sacrificial etching, wafer bonding
2 layer processes: MUMPS process flow, pin joints, hinges |
HW4 | Fab2.ppt,, pdf | HW4soln.pdf
HW4.SIDs collected solutions |
| 6 | 10/2
10/4 |
Beam Theory I: moment/deflection, common spring configurations
Beam Theory II: torsional deflection, matrix representation, simple trusses |
HW5 | Beams-L.pdf | HW5soln.pdf
HW5.SIDs |
| 7 | 10/9
10/11 |
Electrostatics: basic theory
Electrostatic instability: gap and finger pull-in, bistable actuators |
HW6 | Surface
Tension
Actuators2b.pdf Actuators3b.pdf |
HW6.SIDs
collected solutions |
| 8 | 10/16
10/18 |
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| 9 | 10/23
10/25 |
Thermal actuators: force/deflection, response time, power consumption
More actuators: magnetic, piezoelectric, ... |
HW7 | Design/test lab info | |
| 10 | 10/30
11/1 |
Electrostatic actuators: combs, gap-closers, rotary motors, inchworms
Suspension design: non-linearity, cross-axis coupling, buckling/bistable |
HW8 | ||
| 11 | 11/6
11/8 |
Fluids and damping: viscous flow, pipes and channels,
Couette, squeeze-film, surface tension Microfluidics: pumps, valves, diffusion, mixers Resonance: Rayleigh's method |
HW9 | ||
| 12 | 11/13
11/15 |
Assembly
CAD |
HW10 | ||
| 13 | 11/20
11/22 |
Process integration: ADI, TI, Parameswaran and Fedder
NO CLASS: Thanksgiving Holiday |
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| 14 | 11/27
11/29 |
Micro robots
Electronic interfaces |
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| 15 | 12/4
12/6 |
Noise
Packaging |