Class info, homework questions, etc.: news:ucb.class.ee245
Lectures available on the web: http://webcast.berkeley.edu/
| Instructor
Office Hours |
Kristofer S.J. Pister
pister@eecs <-- easiest method of contact. Please use the newsgroup for any general questions. 512 Cory Hall OH: M 11-12, Th 10-11, and by email appointment |
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| TA | Fabian Martinez
fabian@eecs.berkeley.edu |
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| Required Texts | none yet | |||||||
| Suggested references | Elwenspoek & Jansen, Silicon Micromachining
Jaeger, Introduction to Microelectonic Fabrication Kovacs, Micromachined Transducers Sourcebook Madou, Fundamentals of Microfabrication Ristic, Sensor Technology and Devices Senturia, Microsystem Design Sze, Semiconductor Sensors |
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| Grading |
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| Homework | Will emphasize design, layout, and simulation of devices and systems.
Collaboration is encouraged! Cheating is not! |
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| Project | Writeup is due the last week of class. Four pages max, two column
format, no exceptions!
Collaboration is encouraged. Project description. |
| Week | Date | Topic | HW | Notes |
| 1 | 1/19
1/21 |
Introduction: what is MEMS, and what subset will ee245 cover?
Basic IC/MEMS fabrication |
HW1 | Intro
robot fab1 |
| 2 | 1/26
1/28 |
deposition, etching
surface & bulk micromachining |
fab2 | |
| 3 | 2/2
2/4 |
more bulk & surface micromachining | HW2 | |
| 4 | 2/9
2/11 |
beams
gaps |
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| 5 | 2/16
2/18 |
HW3 | actuators1
actuators2 actuators3 |
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| 6 | 2/23
2/25 |
guest lecture: Matt Last
resonators |
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| 7 | 3/2
3/4 |
better approximations: parallel plates, couette damping, squeeze film
damping, effective mass, electrostatic springs
electrostatic pull-in; thermal conductivity, thermal capacity, thermal time constant |
HW4 | |
| 8 | 3/9
3/11 |
Foundry processes | MUMPS1
MUMPS2 |
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| 9 | 3/16
3/18 |
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| 3/23
3/25 |
Spring break | |||
| 10 | 3/30
4/1 |
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| 11 | 4/6
4/8 |
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| 12 | 4/13
4/15 |
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| 13 | 4/20
4/22 |
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| 14 | 4/27
4/29 |
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| 15 | 5/4
5/6 |
Final Exam: thursday 5/19 5-8 pm
Previous semesters:
Fall 1997
Fall 1998
Fall 1999
Fall 2002
Fall 2003
Common MEMS acronyms.