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Travis Massey, Ph.D. 2017

Electrical Engineering
Advisor: Prof. Maharbiz

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Job Interests: Industry/government R&D

Travis received his B.S. in Electrical Engineering and Computer Sciences from UC Berkeley in 2008 with an emphasis in integrated circuits. He is currently working on a microfabricated high density carbon fiber neural recording array under Professors Michel Maharbiz and Kris Pister.

Fabrication and Microassembly of a High-Density Carbon Fiber Neural Recording Array [BPN573]
We present a 32-channel carbon fiber monofilament-based intracortical neural recording array fabricated through
a combination of bulk silicon microfabrication processing and microassembly. This device represents the first truly
two-dimensional carbon fiber neural recording array. The five-micron diameter fibers are spaced at a pitch of 38
microns, four times denser than the state of the art one-dimensional arrays. The fine diameter of the carbon fiber
microwires affords both minimal cross-section and nearly three orders of magnitude greater lateral compliance
than standard tungsten microwires. Both of these serve to minimize the adverse biological response to implanted
devices, particularly compared to conventional implantable microelectrodes. The electrode pitch, in turn, has the
potential to enable localization of individual units by detection at multiple adjacent sites, something traditionally the
domain of polytrodes. The density, channel count, and size scale of this array are enabled by a microfabricated
silicon substrate and a out-of-plane microassembly technique in which individual fibers are inserted through
metallized and isotropically conductive adhesive-filled holes in the oxide-passivated silicon substrate. Insertion is
eased and the fibers aligned to within five milliradians using an array of microfabricated funnels. The device is
insulated in parylene for biocompatibility and electrical isolation, and the recording sites are electroplated with
PEDOT:PSS to an impedance on the order of tens of kiloohms at 1 kHz. Further, this fabrication technique is
scalable to a larger number of electrodes and allows for the potential future integration of microelectronics.

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     Last Updated: Mon 2017-Aug-14 12:17:57

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